With the improvement of IC Manufacturing Technology and process level, CPU is developing towards high integration, miniaturization and multifunction, which leads to the rapid increase of CPU heat. Under high temperature environment, the aging rate, loss rate and failure rate of the chip increase exponentially, affecting the normal work of CPU and related equipment.

Left: power, size and junction temperature of an automobile chip change with time

Right: relationship between failure rate and temperature of electronic products

The CPU of Phytium server also puts forward higher request to the heat dissipation scheme. First, thermal module need to have a larger surface area, higher thermal conductivity and better heat dissipation performance to cope with the large amount of heat generated by high power density. Secondly, the design of heat dissipation scheme should not only satisfy the need of heat dissipation, but also control the noise and take into account the cost. In addition, with the popularization of green energy-saving, low-carbon environmental protection concept and the implementation of national dual-carbon strategic goals, low-power, high-energy efficiency cooling system design goals have become a new challenge.

In order to solve the problem of heat dissipation faced by the CPU of Phytium server and help the industry customers to choose the appropriate heat dissipation scheme for different application scenarios, a few days ago, Phytium company and a number of heat sink manufacturers jointly launched the“Phytium server CPU cooling solution white paper”, involving air-cooled, liquid-cooled and other cooling systems, has passed reliability and stability tests, and successfully applied to the platform chip products.

Air-cooled cooling: general economy

Air-cooled cooling solution

In terms of air-cooled cooling scheme, Phytium and Amin Rui, Bowanda, Kelledi and other manufacturers to develop the cooperation horn radiator. Through the design of heat pipe and horn fin, the heat transfer area of the radiator is increased effectively, thus the thermal resistance of the radiator is reduced greatly. In addition, Phytium has developed l-type air-cooled radiators with shengjiu technology, colady, Amheri, Bowanda and other manufacturers, which have the advantages of compact structure, regular shape and strong versatility.

Liquid-cooled cooling: efficient mute

Liquid-cooled cooling solution

For high-performance applications, Phytium, together with bih electric, AVIC opto-electronics, Haichuan Thermal Energy, Amirui and other manufacturers launched a liquid-cooled cooling scheme. Compared with air-cooled heat dissipation, liquid-cooled heat dissipation scheme has better thermal performance in the case of smaller size, can meet the heat dissipation needs of high power density, and Operation Noise is lower.

Progress in co-operation on heat dissipation ecology

One of the major constraints on the development of high-capacity chips is the ability to dissipate heat. As a leading domestic CPU enterprises, feiteng has been adhering to the“Open and inclusive, win-win cooperation” concept to participate in the construction of domestic cooling ecology. Through co-building the joint laboratory and sharing the heat test equipment and test data with the heat sink manufacturers, the unified heat sink test and evaluation standards are gradually established. In addition, feiteng regularly publishes the“Phytium hardware eco-products manual”(reviewed here) , which promotes the products based on Phytium chip platform to radiators for free, accelerate the construction process of domestic cooling ecology. At present, Phytium has established cooperative relations with nearly 20 heat dissipation manufacturers in China, and has launched 58 heat dissipation products based on Phytium CPU, which are widely used in customer projects, has obtained the customer consistent approval and the high praise.

The white paper will introduce the heat dissipation solution based on Phytium CPU in detail and guide the design and development of heat dissipation products. We warmly welcome the vast number of manufacturers to join the domestic cooling eco-sphere, working together on new air-cooled cooling technologies (such as high performance VC and heat pipes) , reliable mature liquid-cooled cooling technologies (water-cooled, submerged) , new cooling materials and technologies based on multi-phase flow technologies, high performance and high reliability heat conduction interface materials, and high precision heat dissipation testing instruments and equipment, together for the development of domestic chip industry to contribute power!